Thermal Design Power

Thermal design of power component and optimal design of heat sink

功率器件热设计及散热器的优化设计

The Study of Heat Resistance-based Thermal Design in Power Electronic Systems

电力电子系统以热阻为基础的热设计探讨

As the performance of MMIC is sensitive to its channel temperature , the optimum thermal design for power combiner was presented .

由于芯片性能对沟道温度相当敏感，本文在理论分析基础上借助仿真软件进行了大功率器件热设计，为研制连续波大功率合成器做好准备。

Through theoretical thermal design , the power system temperature increase only 30 ℃ at this small size .

通过理论热设计，在小体积大功率的情况下稳态温升为30摄氏度。

Thermal Design of High Power Hermetically Sealed Box

大功率密封机箱的热设计

Has put forward six kinds of projects of thermal design for large power MCM by way of analyzing the temperature fields of MCM using the finite element thermal simulation technique step by step .

针对大功率多芯片组件，利用有限元热模拟技术分析了多芯片组件的温度场，通过循序渐进的方法，提出了六种热设计的方案。

With the huge improvement of electrical driving technology for locomotive , the thermal design and control of power electronic components have became more important and more crucial .

随着机车电传动技术的发展，电力电子元件的散热控制已经变成非常重要而且关键的一个环节。